Copper Bonded Earth Electrode
Vertical earth electrode
Copper bonding thickness of minimum 254 µm
Meets the requirement of IS 3043, IS/IEC 62305, IEC 60364-5-54, UL 467
Tested as per IEC 62561-2
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Vertical earth electrode
Copper bonding thickness of minimum 254 µm
Meets the requirement of IS 3043, IS/IEC 62305, IEC 60364-5-54, UL 467
Tested as per IEC 62561-2
**Technical Specifications:**




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